Thermal Processing Technology
The GENTRON GT2100-18 (N2 Inlet) is a precision-engineered thermal test oven designed for high-dissipation Forward Bias, elevated-temperature Reverse Bias, and Dynamic or Static Burn-In of integrated circuits and other semiconductor devices. Its nitrogen inlet support, advanced engineering, accurate temperature control, uniform thermal distribution, and reliable process repeatability meet the stringent requirements of critical semiconductor testing applications.
Chamber Volume: 5 to 26 cu.ft
Temperature Range: Ambient to +210 °C
Control Accuracy: +1.0 °C
Temperature Uniformity: +3 °C (measured without load)
Control System: PLC with HMI interface
Data Acquisition: Multi-channel temperature recording
Nitrogen Inlet (Optional): Timer-controlled; inert nitrogen displaces oxygen to protect sensitive materials during testing