Thermal Processing Technology
Gentron Burn-In Oven GT2100-23
The GT2100 is designed for accelerated life testing of microcircuit electronic devices, helping identify potential early failures. It is engineered for applications such as high-dissipation forward bias, high-temperature reverse bias, and dynamic or static burn-in of integrated circuits and other semiconductor devices. The oven operates at temperatures up to 200 °C, providing reliable and consistent conditions to ensure semiconductor reliability, performance, and quality assurance.
Temperature Range: Up to 200 °C
Applications: Forward/reverse bias, dynamic/static burn-in of ICs
Purpose: Accelerated life testing to detect early failures
Chamber Volume: 23 cu. ft.
Workspace: Adequate for high-volume device testing