Thermal Processing Technology
The Custom High-Temperature Oven GT3500-C is engineered for precision thermal processing in cleanroom environments. This advanced oven features nitrogen atmosphere control with O2 analyzer capability, ensuring ultra-low oxygen levels for sensitive applications.
Advanced cooling is provided via a Process Cooling Water (PCW) system with stainless steel coil construction. The integrated HEPA filter maintains cleanroom compliance while the automatic sliding-up door enables efficient loading and unloading. This system is ideal for semiconductor processing, advanced electronics manufacturing, and materials engineering requiring strict atmospheric and cleanroom control.
Temperature Range: 35°C to 350°C
Control Uniformity: 3%
Atmosphere: Nitrogen with O2 analyzer control
Cooling System: Process Cooling Water (PCW) with stainless steel coil
HEPA Filter: Class 1000 cleanroom compliant
Access: Automatic sliding-up door for efficient loading/unloading