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AUTO OPTICAL INSPECTION (AOI)
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About This Product
YAYATECH INFRARED (IR) INSPECTION:
For detecting defects such as back chips and hidden chips caused after semiconductor wafer dicing, fully automated wafer infrared inspection machines can automatically detect abnormal defects, reducing the uncertainty and timeliness of human judgment. Moreover, they can detect defects without picking and placing the die, improving product quality control. They also provide functions such as wafer mapping, defect image output, and statistical information.
Key Capabilities:
- Scribe line inspection after Die Saw
- Inspection wafer with Film Frame
- Auto IR inspection micro crack and chipping
- Auto load and unload wafer
- Auto wafer Scan / Sampling inspection