Designed for automated wafer transfer and handling process applications.
Significantly improves Cycle time and process efficiency.
Main Air Pressure Flow Rate: 2000 L/min , configured for Ambient Temperature : 16 to 30 degrees with Relative Humidity : 40-50% transfer lines
Designed for automated Loading & Unloading wafer handling process. Improves Cycle time and process efficiency.
As per customized requirement specification
Main Power Supply : 480 VAC/40A/3 phase/50-60Hz Main Air Pressure Supply : 0.6Mpa – 0.7Mpa
Main Air Pressure Flow Rate: 2000 L/min Ambient Temperature : 16 to 30 deg Relative Humidity : 40-50%
Leave us a message and we will get back to you shortly.