Designed for automated wafer transfer handling process in PV industry manufacturing processes. Configured with alarm and data log system capability for sensing wafer jams and misalignment during the process.
Switch : SSR reed switch for all cylinders
Conveyor alignment capability : within +/- 1 mm Cassette locking: Mechanical lock with pneumatic assist
Wafer Rotator : Rotary suction type with 180 deg rotation Wafer Thickness Capability : 100 to 300 micron wafer thickness
Designed for automated Loading & Unloading wafer handling process
As per customized requirement specification
Alarm : Wafer jam and misalignment system alarm and data log capability
Switch : SSR reed switch for all cylinders
Conveyor alignment capability : within +/- 1 mm Cassette locking: Mechanical lock with pneumatic assist
Wafer Rotator : Rotary suction type with 180 deg rotation Wafer Thickness Capability : 100 to 300 micron wafer thickness
Leave us a message and we will get back to you shortly.