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Automation Solutions
SERVO TRANSFER AUTOMATION
Servo Transfer Automation application includes using sophisticated handling tools to transfer multiple wafer products into and from the process tools.
Using multi-axis lanes to run simultaneously for transfer process with a high Unit per Hour (UPH). Designed with Wafer jam and misalignment system alarm with data log capability.
Servo Transfer Automation application includes using sophisticated handling tools to transfer multiple wafer products into and from the process tools.
Using multi-axis lanes to run simultaneously for transfer process with a high Unit per Hour (UPH)
Pitch : Wafers in walking beam aligned to the conveyor rollers.
No contact to guide disk of conveyor rollers upon dropping by transport picker.
Wafer aligner Capability
load-unload wafer from the process tools with roller/slider/guide Operational height : adjustable within ± 5cm
Loader/Un-loader Automation : Double cassette elevator with common servo drive and Individual Actuator for each Lane.
Wafer transfer module 1x servo axis top pick & place sorting unit.
6x vacuum chuck with 2.5 folded pad Transport system : Belts and conveyor rollers
Alarm : Wafer jam and misalignment system alarm and data log capability Switch : SSR reed switch for all cylinders
Wafer Thickness Capability : 100 to 300 micron wafer thickness
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