The Low Power Chamber is designed to perform accelerated life testing of Microcircuit Electronic devices to identify its possibility of early mortalities. Centrifugal fan draws air through the heater sections, moves it evenly across the Chamber, past the temperature sensors and back to the heater.

Engineered specifically for applications such as high dissipation forward bias, high temperature reverse bias, dynamic and static burn-in of Integrated Chips and other semiconductor devices.

The Chamber application includes Operation Temperature range at 10 ºC up to 200 ºC  and workspace volume of 22 cu.  ft. Designed with 5.4 kW of heating dissipation capacity.