GT2100-21 is designed to perform accelerated life testing of Microcircuit
Electronic devices to identify its possibility of early mortalities.
Engineered specifically for applications such as high dissipation forward bias, high temperature reverse bias, dynamic and static burn-in of Integrated Chips and other semiconductor devices.
It’s application includes Operation Temperature range up to 200 ºC and workspace volume of 23 cu. ft.
GENTRON BURN-IN OVEN GT2100-21 IS ENGINEERED FOR APPLICATIONS SUCH AS HIGH DISSIPATION FORWARD BIAS, HIGH TEMPERATURE REVERSE BIAS, DYNAMIC AND STATIC BURN-IN OF INTEGRATED CHIPS AND OTHER SEMICONDUCTOR DEVICES.
Oven Volume : 23 cu. ft.
Temperature Range : Up to 200 degree C.
Power Source : 415 VAC, Three Phase, 50 Hz, 20KVA. Control Voltage : 110 VAC, 50 Hz.
Motor full load amperes: 3 H.P./ 5.10 A. Heater : 12 KW / 15 A.
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